dicing

英 [ˈdaɪsɪŋ]

美 [ˈdaɪsɪŋ]

v.  将(肉、菜等)切成小方块; 将…切成丁
dice的现在分词

计算机

柯林斯词典

• 骰子;色子
  Adiceis a small cube which has between one and six spots or numbers on its sides, and which is used in games to provide random numbers. In old-fashioned English, 'dice' was used only as a plural form, and the singular wasdie, but now 'dice' is used as both the singular and the plural form.
• 掷骰子游戏
  Diceis a game which is played using dice.
• VERB 把(食物)切成小块;将…切丁
  If youdicefood, you cut it into small cubes.
  1. Dice the onion...
     把洋葱切成丁。
  2. Add the crushed garlic and remaining diced vegetables.
     加入捣碎的大蒜和剩余的蔬菜丁。

双语例句

• Upon the installation of a multi beam laser dicing system, the obviously advantages of using such a laser dicing process become evident.
  基于已经安装的多光束激光划片系统，其显著的优点已经得到证实。
• Normally as a result, material removal rates and therefore dicing speed is lowered and the laser capability with respect to the available power is far from optimized.
  通常情况下，剥离速度和切割速度都是很低的。基于其本身的能力来讲，激光器没有运行在最优化的状态下。
• Performance analysis and three-dimensional modeling of wafer dicing with diamond blade
  金刚石砂轮刀片划切过程性能分析与三维建模
• Some have questioned whether the dicing up of mortgages added any value to the economy.
  有人质疑，将按揭贷款分割出售究竟给市场经济增加了什么价值。
• In this paper, part of theoretical and experimental studies on the application of UV laser in dicing of sapphire wafer and SiC were presented.
  本论文对紫外激光应用于蓝宝石晶圆和碳化硅等材料的划切加工技术进行了部分理论与试验研究工作。
• The system functions mainly include macro dicing, micro planning and district demolition.
  该系统主要有学校宏观划片、微观规划和片区拆迁等功能。
• Dicing area can be washed by water directly and easily be cleaned up.
  切菜区域可直接用水冲刷，清洗方便。
• A multiple beam, sub surface laser dicing technology is currently being developed, which will improve the productivity of such a process significantly.
  多光束内部激光划片技术正在开发中，它将显著提高产量。
• Freddy Krueger plays the vengeful monster who kills by slicing, dicing and chopping people who had murdered him.
  弗雷迪·克鲁格扮演一个复仇的魔鬼，他把那些杀害他的人一一肢解至死。
• After an analysis of the process of semiconductor fabrication, a proposal of the wafer dicing using micro-abrasive waterjet is put forward.
  通过对半导体加工工艺的分析研究，提出了用磨料水射流切割半导体材料，包括晶圆的切割、芯片的终端封装切割。